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11 Sept 2024, Wednesday | 13:15 - 14:40 Hrs

Advanced Packaging - Semiconductor Packaging - India's roadmap to the next frontier


The session on Advanced Packaging and Heterogeneous Integration at SEMICON India will explore how these technologies are addressing the challenges of Moore's Law slowdown and driving innovation in chip design. Experts will discuss how advanced packaging techniques like 2.5D and 3D integration enable the combination of chiplets optimized for different functions, leading to enhanced performance, lower power consumption, and reduced costs.

The session will also highlight the role of heterogeneous integration in enabling the development of next-generation devices for artificial intelligence, high-performance computing, and other demanding applications.