Dr. Raja Swaminathan

Dr. Raja Swaminathan is AMD's CVP of Packaging driving the development of AMD’s industry leading advanced packaging roadmap. At Intel, Apple, and now AMD, his design technology co optimization expertise and relentless pursuit of PPAC optimization (power, performance, area, and cost) have fueled breakthroughs like EMIB, Apple's Mx packages, 3D V Cache, and the recently announced 3.5D architectures for AI.

A Carnegie Mellon PhD and IIT Madras alumnus, Raja has over 100 patents and 40 publications. Recognized as an IEEE Senior Member and trusted advisor to startups, Raja's passion for heterogeneous integration is consistently pushing capabilities of silicon.

Presentation Title

Future of AI Hardware Enabled by Advanced Packaging: How the Burgeoning India Ecosystem Help Lead This Drive

Abstract

TBA