Hem Takiar

Biography

• Over 40 years of extensive experience in semiconductor packaging from design to high volume manufacturing, product development, manufacturing operations, strategic planning and bring up of green field Packaging Factories.
• Renowned technologist & Inventor with over 200 patents
• Experienced in managing global teams, Product Life cycle, Six Sigma, transformational initiatives, and Strategic Partnerships
• Demonstrated success in semiconductor Product packaging and Quality operations.
• Experience includes leadership positions at Western Digital, SanDisk, Novalux and National Semiconductor
• Instrumental at driving several industry initiatives under SEMI
• Masters in Material Science from University of Illinois at Urbana Champaign (US)
• Bachelor’s in Metallurgical Engineering from Indian Institute of Technology Kanpur (India)

Presentation Title

From Chips to Systems: Integrating Advanced Packaging and Smart Manufacturing

Abstract

The demand for higher performance, increased functionality, and energy efficiency requires heterogenous integration in 2.5D or 3 D forms. Advanced packaging plays a crucial role in achieving heterogeneous integration by enabling the seamless integration of diverse components, chips, and materials within a single package.

Micron ability to meet market demand of higher densities, lower power, and cost margins within a shorter time to market is enabled through advanced codesign, state of art smart manufacturing, digital twin UI environment and integrated information systems.

In this talk, we will present

• Advanced co design, simulations and multi domain design integration tools to facilitate early floor planning, optimizing fan out, minimizing interposer layer count and automating schematic flows.
• Integrated UI in Digital Twin Environment for engineering drill down and complete end to end visibility of What’s Happening i n t he Factory through automated yield analysis, scrap analysis, utilization, metrology and test data analytics.
• Smart Manufacturing through big data analytics, artificial intelligence, physical automation, IOT deployment, auto diagnostic s, AR/VR enablement and yield analytics platforms to reduce downtime, reduce cost of ownership, yield improvement, golden tool selection, quality event reduction, consumables reduction and increasing equipment efficiency.