Hem Takiar

Over 40 years of extensive experience in semiconductor packaging from design to high volume manufacturing, product development, manufacturing operations, strategic planning.  Experienced in managing global teams, Product Life cycle, Six Sigma, transformational initiatives and Strategic Partnerships, demonstrated success in semiconductor/product packaging and Quality operations.

His experience includes leadership positions at Western Digital, SanDisk, Novalux and National Semiconductor Instrumental at driving several industry initiatives under SEMI Masters in Material Science from University of Illinois at Urbana-Champaign (US)
Bachelor in Metallurgical Engineering from Indian Institute of Technology Kanpur (India).